Bioleaching Of Copper And Nickel From Mobile Phone Printed Circuit Board Using Aspergillus Fumigatusa2ds

Abstract

he recovery of metals from electronic waste was investigated by using fungal strain Aspergillus fumigatus A2DS, isolated from the mining industry wastewater. Fifty-seven percent of copper and 32% of nickel were leached (analyzed by Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-OES)) by the organism after one-step leaching at a temperature of 30 °C (shaking condition for 7 days). Maximum % of copper and nickel were obtained at a pH of 6 (58.7% Cu and 32% Ni), the temperature of 40 °C (61.8% Cu and 27.07% Ni), a pulp density of 0.5% (62% Cu and 42.37% Ni), and inoculums of 1% (58% Cu and 32.29% Ni). The XRD pattern of PCB showed 77.6% of copper containing compounds. XRD analysis of the leachate residue showed only 23.2% Euchorite (ASCu2H7O8) and 9.4% other copper containing compounds, indicating the leaching property of the fungus. HPLC analysis of the spent …